Wafer sheet expanding apparatus and pellet bonding apparatus using thereof
US6189591A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Jan 22, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer sheet expanding apparatus comprises an expanding mechanism, a rotating mechanism for the expanding mechanism, a motor, a power transfer mechanism. The expanding mechanism has a support ring, an expanding ring, and a movement mechanism. The support ring has a hole at a central part thereof and a circular annulus portion formed projectively on an outer-peripheral portion of the hole and an upper end for supporting a wafer sheet retained by a wafer ring. The expanding ring is disposed opposite the support ring and has an annular portion that is loosely fitted over the circular annulus portion. The movement mechanism causes relative movement of the support ring and the expanding ring. The expanding mechanism stretches the wafer sheet by relative movement of the support ring and the expanding ring. The power transfer mechanism connects the movement mechanism and the rotating mechanism to a motor selectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.