Heat sink with a heat pipe for spreading of heat
US6189601A · kind A · utility
71Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | May 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention provides a heat sink for cooling and electronic device. The heat sink includes a member, and a heat pipe secured to the member. The member has a first portion, a second portion, and a plurality of fins on the second portion. The heat pipe has a first, evaporator section and a second, condenser section. The first section is located at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device. The second section is located at the second portion so that heat can be transferred therefrom to the second portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.