pH-buffered slurry and use thereof for polishing
US6190237A · kind A · utility
46Cited by
29References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1997 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Nov 6, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry containing abrasive particles and a pH buffering component comprising at least one acid or salt thereof and at least one base is especially useful for polishing surfaces, including those used in microelectronics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.