Photosensitive resin composition, and multilayer printed circuit board using the same
US6190834A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | May 6, 1998 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | May 6, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S522/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a photosensitive resin composition capable of forming an insulating film, which is superior in both a roughening property and an adhesiveness, and a via-hole, which is highly reliable in connection, and a multilayer printed circuit board. The present invention provides a photosensitive resin composition containing a first resin, which is an epoxy resin, and a second resin having a N-substituted carbamic acid ester atomic group and a radical polymeric unsaturated bond in its side chain. The second resin is desirably an oligomer having a repeating unit expressed by the following general formula (chem. 1) or (chem. 3) by 3-10 units. Where, X is H or CH.sub.3, Y and Z is H or an alkyl group of carbon number 1-4, n is 0 or 1, a part of R.sup.1 is an atomic group expressed by the following general formula (chem. 2), the residual R.sup.1 is a hydroxyl group, and R.sup.2 is an alkylene group of carbon number 1-4. ##STR1##
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.