Methods of forming semiconductor devices and methods of forming field emission displays
US6190929A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Jul 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/025
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In one aspect, the invention encompasses a method of forming a semiconductor device. A masking material is formed over a semiconductor substrate. A mold is provided, and the mold has a first pattern defined by projections and valleys between the projection. The masking material is pressed between the mold and the substrate to form a second pattern in the masking material. The second pattern is substantially complementary to the first pattern. The mold is removed from the masking material, and subsequently the masking material is utilized as a mask during etching of the semiconductor substrate. In another aspect, the invention encompasses a method of forming a field emission display. A first material layer is formed over a conductive substrate, and a masking material is formed over the first material layer. A mold is provided over the mask material, and the mask material is pressed between the mold and the first material layer to pattern the masking material. The pattern is transferred from the masking material to the first material layer. The patterned first material layer is then used as a second mask, and the conductive substrate is etched to form a plurality of conically shaped …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.