Demountable heat spreader and high reliability flip chip package assembly
US6191478A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 7, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Jun 7, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A demountable heat spreader assembly utilizing a unique retainer frame for demountably retaining a heat spreader having a flexible thermal interface material disposed in a cavity of the heat spreader is disclosed. The retainer frame allows a substrate having a flip chip IC mounted thereon to be snapped into the retainer frame. The heat spreader also snaps into the retainer frame and is positioned in the retainer frame so that the flexible thermal interface material contacts the IC with a slight interference. The flexible thermal interface material provides effective thermal coupling between the IC and the heat spreader and loose mechanical coupling between the IC and heat spreader. Thermomechanical stress caused by heating or cooling of the IC is reduced by the loose coupling between the IC and the flexible thermal interface material. The retainer frame allows for the heat spreader and the substrate to be removed and can be made from low cost materials such a plastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.