Patent · US Expired

Smart card module and smart card including a smart card module

US6191951A · kind A · utility

31Cited by

9References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Detlef Houdeau · Langquaid, DE
Josef Mundigl · Duggendorf, DE
Frank Pueschner · Kelheim, DE
Peter Stampka · Burglengenfeld, DE
Michael Huber · Bad Abbach, DE
Josef Heitzer · Neutraubling, DE

Key dates

Filing date	Sep 3, 1999
Grant date	Feb 20, 2001
Priority date	—
Expiry date	Sep 3, 2019

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/16
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.