Sealed multi-chip module cooling system
US6192701A · kind A · utility
15Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Aug 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for absorbing thermal energy from an integrated circuit device while preventing the formation of condensation thereon. The cooling system comprises a evaporator unit mounted on an integrated circuit device, housed within an airtight enclosure which is evacuated and then pressurized with dry air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.