Prabjit Singh
82Patents
16h-index
88Co-inventors
87Inventor score
Filing activity: Aug 14, 1991 → Dec 22, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7301770B2 | Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins | Electricity | 64 | Expired |
| US6125036A | Moisture barrier seals for cooled IC chip module assemblies | Electricity | 61 | Expired |
| US6233959A | Dehumidified cooling assembly for IC chip modules | Electricity | 53 | Expired |
| US8867209B2 | Two-phase, water-based immersion-cooling apparatus with passive deionization | Emerging Cross-Sectional Technologies | 46 | Active |
| US7816785B2 | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package | Electricity | 41 | Active |
| US6243268A | Cooled IC chip modules with an insulated circuit board | Electricity | 34 | Expired |
| US6587345B2 | Electronic device substrate assembly with impermeable barrier and method of making | Emerging Cross-Sectional Technologies | 32 | Expired |
| US6940712B2 | Electronic device substrate assembly with multilayer impermeable barrier and method of making | Electricity | 29 | Expired |
| US7440281B2 | Thermal interface apparatus | Electricity | 27 | Expired |
| US8387249B2 | Apparatus and method for facilitating servicing of a liquid-cooled electronics rack | Emerging Cross-Sectional Technologies | 27 | Active |
| US8806749B2 | Two-phase, water-based immersion-cooling apparatus with passive deionization | Emerging Cross-Sectional Technologies | 25 | Active |
| US6246581A | Heated PCB interconnect for cooled IC chip modules | Electricity | 23 | Expired |
| US7133286B2 | Method and apparatus for sealing a liquid cooled electronic device | Electricity | 23 | Expired |
| US6233960A | Spot cooling evaporator cooling system for integrated circuit chip modules | Electricity | 20 | Expired |
| US7085135B2 | Thermal dissipation structure and method employing segmented heat sink surface coupling to an electronic component | Electricity | 20 | Expired |
| US7254888B2 | Method for manufacturing graphite-base heat sinks | Emerging Cross-Sectional Technologies | 20 | Expired |
| US5167513A | Load limited pin for an electrical connector | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6192701A | Sealed multi-chip module cooling system | Electricity | 15 | Expired |
| US9568445B2 | Salt-based device and a circuit to monitor and log the times a data center air goes above a predefined limit | Performing Operations; Transporting | 14 | Active |
| US7673389B2 | Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component | Emerging Cross-Sectional Technologies | 13 | Active |
| US6794571B1 | EMC sealing system and method for an electrical enclosure | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6918438B2 | Finned heat sink | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6255832A | Flexible wafer level probe | Physics | 12 | Expired |
| US9357682B2 | Cooling method with automated seasonal freeze protection | Mechanical Engineering; Lighting; Heating | 11 | Active |
| US8672688B2 | Land grid array interposer with compressible conductors | Emerging Cross-Sectional Technologies | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.