Bump bonding apparatus
US6193130A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Feb 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01051
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bump bonding apparatus comprising: a loader section that holds trays which accommodate semiconductor pellets and an unloader section that holds trays which accommodate semiconductor pellets to which bumps have been applied, the loader and unloader sections being provided next to each other on one side of a bonding stage; a buffer station and a supply and holding station provided so as to positionally correspond to the loader section and unloader section, respectively; a first pusher for sending trays from the loader section to the buffer station, a second pusher for sending trays from the supply and holding station to the unloader section, a third pusher for sending trays from the buffer station to the supply and holding station, and a pellet transfer mechanism for picking up a semiconductor pellet in the tray in the supply and holding station, transferring it to the bonding stages and then returning the semiconductor pellets to which bumps have been applied on the bonding stages back to the tray in which the semiconductor pellet has been accommodated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.