Method and apparatus for grinding wafers using a grind chuck having high elastic modulus
US6193586A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 1998 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Dec 24, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for grinding wafers without using an ultraviolet tape attached to the front face of the wafer reduces manufacturing costs, simplifies the grinding process and protects the semiconductor chips formed on the front face of the wafer from being damaged by static electricity. The grinding apparatus uses a grind chuck formed of a soft material having a high elastic modulus and a rising groove formed in the grind chuck. Deionized water is supplied onto the wafer from a first direction. Simultaneously, deionized water or air is supplied into the rising groove of the grind chuck from a second direction opposite to the first direction. The circumferential edge of the wafer overlaps the rising groove, such that the simultaneous supply of deionized water and/or air from the two directions protects the front surface of the wafer from being contaminated by silicon dust. The soft material of the grind chuck also protects the front surface of the wafer from being damaged by pressure from the grind unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.