Do-yun Hwang
4Patents
3h-index
3Co-inventors
36Inventor score
Filing activity: Nov 7, 1996 → Feb 17, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5840614A | Method of producing a semiconductor wafer using ultraviolet sensitive tape | Electricity | 28 | Expired |
| US6193586A | Method and apparatus for grinding wafers using a grind chuck having high elastic modulus | Performing Operations; Transporting | 14 | Expired |
| US6629876B1 | Apparatus for grinding wafers using a grind chuck having a high elastic modulus | Performing Operations; Transporting | 6 | Expired |
| US6269281A | Back lapping in-line system for semiconductor device fabrication | Performing Operations; Transporting | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.