Inline ground-signal-ground (GSG) RF tester
US6194739A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Nov 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer configured for in-process testing of electrical components has a plurality of dies disposed on the wafer, wherein adjacent dies are separated from one another by streets. An in-line device monitor having a first port, a second port, and a device-under-test substantially in line with one another is placed within a street, where the device-under-test is between the first and second ports and is electrically coupled to the first and second ports. With such an arrangement, streets having a width of 100 microns and less are suitable for accomodating a RF-device monitor having ground-signal or ground-signal-ground configurations. As a result, accurate GS or GSG RF-device monitors can be provided in narrow streets of wafers, thereby increasing the amount of wafer area available for circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.