Support members for wafer processing fixtures
US6196211A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Apr 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67306
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating support members for wafer processing fixtures is disclosed. In the first step of the method, an elongate support member basic form is provided. The basic form has a substantially wedge-shaped cross-section and angular edges. Next, the edges of the support member basic form are machined to replace the angular edges with substantially arcuate edges. A plurality of wafer-retaining slots are cut along one side of the support member basic form. The support member basic form can include a front surface and a rear surface, with at least one angular edge occurring on each of the surfaces. The step of machining the edges of the support member basic form can be performed as machining the edges on the respective surfaces to radii of between 0.25" and 5.25". In an embodiment, the at least one angular edge occurring on the rear surface can be machined to a radius of approximately 1.5", and the at least one angular edge occurring on the front surface can be machined to a radius of approximately 0.35". At least one attachment structure can be provided on at least one terminal end of the support member basic form. In an embodiment, the attachment structure can be provided a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.