Production of insulating varnishes and multilayer printed circuit boards using these varnishes
US6197149A · kind A · utility
8Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1998 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Apr 9, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249952
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An insulating varnish comprising a resin component, electrical insulating whiskers, and if necessary, one or more additives such as an ion adsorbent, and/or an organic reagent for preventing injury from copper, produced by adding the additives to the resin component and the whiskers, or filtering the whiskers, or milled by using a beads mill or a three-roll mill, or the like, is excellent for producing a multilayer printed circuit board having high wiring density, high reliability and excellent other electrical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.