Rolled copper foil for flexible printed circuit and method of manufacturing the same
US6197433A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 12, 2000 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Jan 12, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12431
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rolled copper foil for flexible printed circuits contains not more than 10 ppm by weight of oxygen and has a softening-temperature rise index T defined as T=0.60[Bi]+0.55[Pb]+0.60[Sb]+0.64 [Se]+1.36[S]+0.32[As]+0.09[Fe]+0.02[Ni]+0.76[Te]+0.48[Sn]+0.16[Ag]+1.24[P] (each symbol in the brackets representing the concentration in ppm by weight of the element) in the range of 4 to 34. The concentrations of the elements are in the ranges of[Bi]<5, [Pb]<10, [Sb]<5, [Se]<5, [S]<15, [As]<5, [Fe]<20, [Ni]<20, [Te]<5, [Sn]<20, [Ag]<50, and [P]<15 (each symbol in the brackets representing the concentration in ppm by weight of the element). The foil has a thickness in the range of 5 to 50 .mu.m and a half-softening temperature of 120 to 150.degree. C., is capable of continuously retaining a tensile strength of at least 300 N/mm.sup.2 at 30.degree. C., and possesses excellent flex property and adequate softening property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.