Patent assignee · JP · COMPANY

Nippon Mining & Metals Co., Ltd.

165Patents
58Active
165Granted
47Portfolio score

Filing activity: Sep 17, 1991 → Sep 11, 2009 · 58 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US5224534A Method of producing refractory metal or alloy materials Mechanical Engineering; Lighting; Heating 24 Expired
US7435325B2 Method for producing high purity nickle, high purity nickle, sputtering target comprising the high purity nickel, and thin film formed by using said spattering target Emerging Cross-Sectional Technologies 23 Expired
US7156963B2 Tantalum sputtering target and method for preparation thereof Emerging Cross-Sectional Technologies 20 Expired
US7510635B2 High purity zinc oxide powder and method for production thereof, and high purity zinc oxide target and thin film of high purity zinc oxide Chemistry; Metallurgy 18 Expired
US7393395B2 Surface-treating agent for metal Electricity 18 Expired
US6197433A Rolled copper foil for flexible printed circuit and method of manufacturing the same Emerging Cross-Sectional Technologies 17 Expired
US7507304B2 Copper alloy sputtering target and semiconductor element wiring Electricity 16 Expired
US7699965B2 Zinc oxide-based transparent conductor and sputtering target for forming the transparent conductor Emerging Cross-Sectional Technologies 14 Active
US7347353B2 Method for connecting magnetic substance target to backing plate, and magnetic substance target Emerging Cross-Sectional Technologies 14 Expired
US7635440B2 Sputtering target, thin film for optical information recording medium and process for producing the same Emerging Cross-Sectional Technologies 14 Expired
US6613451B1 Metallic material Emerging Cross-Sectional Technologies 14 Expired
US5783057A Method of purifying copper electrolytic solution Emerging Cross-Sectional Technologies 13 Expired
US7716806B2 Tantalum sputtering target and method for preparation thereof Emerging Cross-Sectional Technologies 13 Active
US6093499A Copper alloy foils Emerging Cross-Sectional Technologies 13 Expired
US6403234B1 Plated material for connectors Emerging Cross-Sectional Technologies 13 Expired
US7799301B2 Cathode material for lithium secondary battery and manufacturing method thereof Emerging Cross-Sectional Technologies 12 Active
US7341796B2 Copper foil having blackened surface or layer Emerging Cross-Sectional Technologies 12 Expired
US7740717B2 Tantalum sputtering target and method for preparation thereof Emerging Cross-Sectional Technologies 12 Active
US7217310B2 Metal powder for powder metallurgy and iron-based sintered compact Performing Operations; Transporting 12 Expired
US7740721B2 Copper alloy sputtering target process for producing the same and semiconductor element wiring Electricity 11 Expired
US5680473A Surface inspection device Physics 11 Expired
US7156964B2 Sputtering target for phase-change memory, film for phase change memory formed by using the target, and method for producing the target Electricity 10 Expired
US7279211B2 Sputtering target containing zinc sulfide as major component, optical recording medium on which phase change optical disk protective film containing zinc sulfide as major component is formed by using the target, and method for manufacturing the sputtering target Emerging Cross-Sectional Technologies 10 Expired
US7699948B2 Ta sputtering target and method for preparation thereof Chemistry; Metallurgy 9 Expired
US7241368B2 Hafnium silicide target for gate oxide film formation and its production method Chemistry; Metallurgy 9 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.