Process for the manufacture of passive and active components on the same insulating substrate
US6197695A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Oct 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/974
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to a process for the manufacture of one electronic structure comprising at least one active component and at least one passive component or element on a support substrate made of an insulating material. A characteristic process comprises the following steps: PA1 make the active component in a surface layer made of semiconducting material from an initial substrate comprising a wafer of semiconducting material supporting the said surface layer, PA1 make electrical insulation areas capable of insulating the passive component or element from the active component, PA1 make the passive component or element on and/or in the electrical insulation areas, PA1 prepare the surface of the initial substrate face with the said electronic structure to make this face compatible for bonding with another substrate by molecular bonding, PA1 perform the bonding, the other substrate being the said support substrate made of an insulating material, PA1 eliminate all or part of the wafer of semiconducting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.