Rapid heating and cooling vacuum oven
US6198075A · kind A · utility
7Cited by
9References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Nov 24, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B31/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An oven for processing semiconductor wafers comprised of a first cylindrical canister, a second cylindrical canister that surrounds the first canister, and a third cylindrical canister that surrounds the second canister. The first canister is comprised of thin stainless steel so that it can be heated and cooled rapidly by band heaters positioned around its exterior. The second canister is comprised of stainless that it thermally insulates the first canister. The third canister is comprised of stainless steel that is thicker than the second canister so that the third canister can hold a sufficient vacuum for processing the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.