Autoclave bonding of sputtering target assembly
US6199259A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1996 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Sep 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49885
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Fabrication techniques for an integrated sputtering target assembly include pressure assisted bonding of soldered layers of material, in particular, soldering of the target material to its backing plate; pressure assisted curing of structural adhesives used to join a finned cover plate to a backing plate which between them form passages for fluid cooling; and bonding an electrical insulating layer to the back surface of the backing plate. The pressure to assist in bonding is typically applied by an autoclave. The cooling fluid passages disposed between a cover and a finned backing plate can be sealed by using laser welding or electron beam welding rather than closing the cooling passages with structural adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.