Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
US6199563A · kind A · utility
18Cited by
13References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Feb 18, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrasonic bath (30) is arranged below a wafer processing bath (10). Wafers (40) are processed while ultrasonic waves are transmitted from the ultrasonic bath (30) to the wafer processing bath (10). The wafers (40) are processed while being entirely dipped into the wafer processing bath (10) and rotated by wafer rotating rods (53).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.