Kazutaka Yanagita
58Patents
17h-index
41Co-inventors
84Inventor score
Filing activity: Jan 29, 1998 → Mar 28, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8227032B2 | Method of forming silicon oxide containing films | Electricity | 453 | Active |
| US6624047B1 | Substrate and method of manufacturing the same | Electricity | 117 | Expired |
| US6376332B1 | Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method | Electricity | 60 | Expired |
| US6342433B1 | Composite member its separation method and preparation method of semiconductor substrate by utilization thereof | Electricity | 52 | Expired |
| US6382292B1 | Method and apparatus for separating composite member using fluid | Emerging Cross-Sectional Technologies | 50 | Expired |
| US6426270B1 | Substrate processing method and method of manufacturing semiconductor substrate | Electricity | 39 | Expired |
| US6391743B1 | Method and apparatus for producing photoelectric conversion device | Emerging Cross-Sectional Technologies | 38 | Expired |
| US6946052B2 | Separating apparatus and processing method for plate member | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6605518B1 | Method of separating composite member and process for producing thin film | Emerging Cross-Sectional Technologies | 33 | Expired |
| US6418999B1 | Sample separating apparatus and method, and substrate manufacturing method | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6825099B2 | Method and apparatus for separating member | Electricity | 21 | Expired |
| US6653205B2 | Composite member separating method, thin film manufacturing method, and composite member separating apparatus | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6597039B2 | Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof | Electricity | 19 | Expired |
| US6199563A | Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6746559B2 | Method and apparatus for separating composite member using fluid | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6436226B1 | Object separating apparatus and method, and method of manufacturing semiconductor substrate | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6767840B1 | Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method | Electricity | 18 | Expired |
| US6475323B1 | Method and apparatus for separating composite member using fluid | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6527031B1 | Sample separating apparatus and method, and substrate manufacturing method | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6900114B2 | Separating apparatus, separating method, and method of manufacturing semiconductor substrate | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6672358B2 | Sample processing system | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6380099B2 | Porous region removing method and semiconductor substrate manufacturing method | Electricity | 13 | Expired |
| US6127281A | Porous region removing method and semiconductor substrate manufacturing method | Electricity | 11 | Expired |
| US6427748B1 | Sample processing apparatus and method | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6653206B2 | Method and apparatus for processing composite member | Emerging Cross-Sectional Technologies | 11 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.