Method for enhancing the solderability of a surface
US6200451A · kind A · utility
20Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1999 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Feb 17, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/007
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.