Method for fabricating semiconductor devices
US6200734A · kind A · utility
11Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Jun 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is a method for forming semiconductor devices from a substrate having a non-planar surface. An anti-reflection coating is formed between the substrate and photoresist layer to alleviate the problems caused by non-uniform reflection at the substrate surface during exposure of the photoresist layer. Three-layer and two-layer stacks are described for use with UV and i-line exposure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.