Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric
US6201194A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Dec 2, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique for forming an organic chip carrier or circuit board, having two voltage planes and at least two signal planes is provided which includes bonding a first layer of photolithographic dielectric material to a first metal layer and exposing the first layer of dielectric material to a pattern of radiation to provide at least one opening through the first layer of the dielectric material. A second metal layer is bonded to the first layer of photoimageable material on the opposite side from the first metal layer. Holes are etched in the first and second metal layers which correspond to and are larger than each of the patterns on said openings in the first layer of dielectric material. The exposed pattern on the first layer of dielectric material is then developed, with the openings in the first and second metal layers being larger than the corresponding developed opening in the first dielectric material. Second and third layers of photoimageable dielectric material are applied on the first and second metal layers, respectively and are photopatterned and developed to provide openings in each of the second and third layers of dielectric material some of which correspond to each …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.