Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system
US6201253A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Oct 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of planarizing a first side of a semiconductor wafer with a polishing system includes the step of polishing the first side of the wafer in order to remove material from the wafer. The method also includes the step of moving a lens of a confocal optical system between a number of lens positions so as to maintain focus on the first side of the wafer during the polishing step. The method further includes the step of determining a rate-of-movement value based on movement of the lens during the moving step. Moreover, the method includes the step of stopping the polishing step if the rate-of-movement value has a predetermined relationship with a movement threshold value. An apparatus for polishing a first side of a semiconductor wafer is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.