Printed circuit board with thermal conductive structure
US6201300A · kind A · utility
65Cited by
11References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Aug 24, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board thermal conductive structure comprises a thermal spreader layer having an embossed pattern formed on its surface, an adhesive glue layer formed over the thermal spreader, and a surface metallic layer attached to the thermal spreader and the glue layer. A portion of the surface metallic layer is in direct contact or almost direct contact with the thermal spreader. Furthermore, an additional external heat sink can be attached to thermal conductive structure to increase the efficiency of heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.