Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same
US6201309A · kind A · utility
7Cited by
3References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reusable packaging material for semiconductor devices. The semiconductor device package is formed from a thermoplastic resin. The resin has good fluidity and good adhesion. The new package is recyclable because the thermoplastic resin hardening process is reversible. The new package has sufficient mechanical strength and adhesion to seal a semiconductor device. A thermoplastic material for sealing a semiconductor element is characterized by 4.5.times.10.sup.-5 [1/.degree.C.] or less linear thermal expansivity at about 150-200 .degree.C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.