Tomoko Honda
7Patents
3h-index
15Co-inventors
54Inventor score
Filing activity: Jun 8, 1998 → Jul 13, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6201309A | Thermoplastic material for sealing a semiconductor element, semiconductor device sealed by the material, and the process for manufacturing the same | Electricity | 7 | Expired |
| US8130170B2 | Electronic apparatus | Electricity | 6 | Active |
| US8054240B2 | Electronic apparatus | Electricity | 5 | Active |
| US8812062B2 | Electronic apparatus | Electricity | 3 | Active |
| US8986575B2 | Low-temperature curable conductive paste for plating and electric wiring using the same | Electricity | 2 | Active |
| US11866550B2 | Fluoropolyether compound, lubricant, and magnetic disk | Chemistry; Metallurgy | 0 | Active |
| US7907093B2 | Electronic device and method for manufacturing same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.