Patent · US Expired

High-density electrical interconnect system

US6203347A · kind A · utility

12Cited by
36References
23Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 28, 1999
Grant dateMar 20, 2001
Priority date
Expiry dateSep 28, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S439/931
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An electrical connector includes a projection-type interconnect component and a receiving type interconnect component. The projection-type interconnect component includes an insulative buttress and a plurality of electrically conductive contacts. The contacts are spaced from each other around a circumference of the insulative buttress. The receiving-type interconnect component is adapted for receiving the projection-type interconnect component. The receiving-type interconnect component includes a plurality of flexible, electrically conductive contacts and a spacer movable relative to the flexible contacts. The spacer at least partially flexes the flexible contacts when the spacer is in a first position. The insulative buttress of the projection-type interconnect component displaces the spacer of the receiving-type interconnect component when the projection-type interconnect component is received by the receiving-type interconnect component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.