Chemical mechanical polishing tool components with improved corrosion resistance
US6203417A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Components of chemical, mechanical, polishing apparatus with components resistant to chemical attack by chemical slurries used in the polishing of semiconductor wafers. Among the components that are improved to enhance resistance to chemical attack are the polishing platen, pad conditioning end effectors, various subassemblies, housings for instrumentation, carrier rinse station surfaces, and other components that come into contact with a slurry. The coating compositions are preferably tightly adherent to the underlying substrate, and may be applied by a wide range of techniques. Especially useful are coatings such as tungsten carbide, tungsten nitride, amorphous diamond like carbon, and other such inert wear resistant coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.