Corrosion-free multi-layer conductor
US6203926A · kind A · utility
2Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Dec 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A corrosion resistant, multi-layer structure on a substrate including an adhesion metallic layer on the substrate, a cushion metallic layer on the adhesion layer, a diffusion barrier layer on the cushion layer, and an impermeable gold layer that encapsulates all the layers, is substantially even on all sides of the layers, and contacts a region on the substrate adjacent the layers to prevent oxidation and corrosion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.