Semiconductor wafer pretreatment utilizing ultraviolet activated chlorine

US6204120A · kind A · utility

Assignee

• AG Associates (Israel) Ltd. · IL

Inventors

• Yitzhak Gilboa · Sunnyvale, US
• Benjamin Brosilow · Afula, IL
• Sagy Levy · Jerusalem, IL
• Hedvi Spielberg · Sunnyvale, US
• Itai Bransky · Haifa, IL

Key dates

• Filing date: Sep 28, 1998
• Grant date: Mar 20, 2001
• Expiry date: Sep 28, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/906

Abstract

Systems and methods are described for semiconductor wafer pretreatment. A method of treating a semiconductor wafer, includes contacting the semiconductor wafer with a mixture including HF and CH.sub.3 OH; and then contacting the semiconductor wafer with Cl.sub.2 and simultaneously exposing said semiconductor wafer to a source of ultraviolet energy. The selective HSG temperature of formation window is widened. In addition, robustness with regard to changes in the reactor ambient and substrate condition, and selectivity with regard to underlying dielectric layers, are both improved.