System for measuring the temperature of a semiconductor wafer during thermal processing
US6204484A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1998 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Mar 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for heat treating semiconductor wafers is disclosed. In accordance with the present invention, the apparatus includes a temperature measuring system for determining the temperature of semiconductor wafers being heated within the apparatus. The temperature measurement system includes a shield member made from, for instance, ceramic which is placed adjacent to the semiconductor wafer being heated. A temperature measuring device, such as a thermocouple, is placed in association with the shield member. As the wafer is heated, the temperature of the shield member is monitored. Based on a predetermined calibration curve, by knowing the temperature of the shield member, the temperature of the semiconductor wafer can be estimated with reasonable accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.