Sing-Pin Tay
24Patents
17h-index
34Co-inventors
81Inventor score
Filing activity: Apr 7, 1986 → Dec 12, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6451713B1 | UV pretreatment process for ultra-thin oxynitride formation | Electricity | 467 | Expired |
| US5362669A | Method of making integrated circuits | Emerging Cross-Sectional Technologies | 107 | Expired |
| US4996081A | Method of forming multiple nitride coating on silicon | Electricity | 73 | Expired |
| US5352923A | Trench resistors for integrated circuits | Emerging Cross-Sectional Technologies | 51 | Expired |
| US6200023A | Method for determining the temperature in a thermal processing chamber | Physics | 51 | Expired |
| US5296258A | Method of forming silicon carbide | Chemistry; Metallurgy | 48 | Expired |
| US5316978A | Forming resistors for intergrated circuits | Emerging Cross-Sectional Technologies | 45 | Expired |
| US5516710A | Method of forming a transistor | Electricity | 44 | Expired |
| US6303524A | High temperature short time curing of low dielectric constant materials using rapid thermal processing techniques | Electricity | 42 | Expired |
| US6204484A | System for measuring the temperature of a semiconductor wafer during thermal processing | Electricity | 39 | Expired |
| US6359263B2 | System for controlling the temperature of a reflective substrate during rapid heating | Electricity | 39 | Expired |
| US6075922A | Process for preventing gas leaks in an atmospheric thermal processing chamber | Electricity | 39 | Expired |
| US6403923B1 | System for controlling the temperature of a reflective substrate during rapid heating | Electricity | 38 | Expired |
| US6707011B2 | Rapid thermal processing system for integrated circuits | Electricity | 26 | Expired |
| US5773871A | Integrated circuit structure and method of fabrication thereof | Electricity | 23 | Expired |
| US5726084A | Method for forming integrated circuit structure | Electricity | 19 | Expired |
| US6600138B2 | Rapid thermal processing system for integrated circuits | Electricity | 17 | Expired |
| US4968641A | Method for formation of an isolating oxide layer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US8236706B2 | Method and apparatus for growing thin oxide films on silicon while minimizing impact on existing structures | Electricity | 11 | Active |
| US4836902A | Method and apparatus for removing coating from substrate | Electricity | 10 | Expired |
| US7977258B2 | Method and system for thermally processing a plurality of wafer-shaped objects | Electricity | 9 | Active |
| US4859303A | Method and apparatus for removing coating from substrate | Electricity | 7 | Expired |
| US6706643B2 | UV-enhanced oxy-nitridation of semiconductor substrates | Electricity | 5 | Expired |
| US7151060B2 | Device and method for thermally treating semiconductor wafers | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.