Method and apparatus of manufacturing an electronic circuit board
US6204490A · kind A · utility
15Cited by
15References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1999 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Jun 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20.degree. C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5.degree. C./second.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.