Vacuum coupling system
US6205652A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Jun 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T483/1707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vacuum coupling system according to the present invention is a mechanism that is used accurately to position and connect a vacuum coupling to a valve mechanism of a shell, which is formed by integrally attracting a wafer and a contactor to a wafer chuck by vacuum suction, in conducting a reliability test or other tests on IC chips that is formed on the wafer. This system comprises an air cylinder for advancing the vacuum coupling toward the valve mechanism, a positioning member to be advanced together with the vacuum coupling, a guide member for guiding the vacuum coupling to the valve mechanism in cooperation with the positioning member, a guide rail for guiding the around the wafer chuck while the positioning member is advancing, and a pair of POGO pins for returning the air cylinder to its neutral position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.