Method for dispensing underfill and devices formed
US6207475A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for dispensing underfill in a flip chip package formed of an IC chip and a substrate and devices formed by such methods are disclosed. The method for dispensing may be carried out by either a screen printing (or stencil printing) or a dispensing head process wherein droplets of an underfill material may be dispensed on the surface of an IC die or a substrate. Numerous benefits may be achieved by the present invention for dispensing an underfill material which includes shorter cycle time, superior quality product and more flexible processing parameters. The underfill material may be cured in the same reflow furnace during the reflow process for the solder balls such that a separate curing process can be eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.