Hsing-Seng Wang
10Patents
8h-index
7Co-inventors
57Inventor score
Filing activity: Jan 30, 1996 → Apr 12, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5977626A | Thermally and electrically enhanced PBGA package | Electricity | 282 | Expired |
| US5736785A | Semiconductor package for improving the capability of spreading heat | Electricity | 137 | Expired |
| US6590282B1 | Stacked semiconductor package formed on a substrate and method for fabrication | Electricity | 107 | Expired |
| US6207475A | Method for dispensing underfill and devices formed | Electricity | 79 | Expired |
| US6479321B2 | One-step semiconductor stack packaging method | Electricity | 26 | Expired |
| US5783860A | Heat sink bonded to a die paddle having at least one aperture | Electricity | 22 | Expired |
| US6255140A | Flip chip chip-scale package | Electricity | 22 | Expired |
| US6536653B2 | One-step bumping/bonding method for forming semiconductor packages | Electricity | 11 | Expired |
| US5789270A | Method for assembling a heat sink to a die paddle | Electricity | 7 | Expired |
| US5672547A | Method for bonding a heat sink to a die paddle | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.