Method for fabricating bump electrodes with a leveling step for uniform heights
US6207550A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1998 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Jun 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0278
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method for mounting a semiconductor element, the method requiring no strict flatness for a substrate and being reliable in a semiconductor device produced by mounting a semiconductor element on a circuit substrate. In the multilayer circuit substrate comprising bump electrodes formed of a conductive paste, a conductive adhesive is applied to the top of bump electrodes and then leveled to obtain the end portions on the bump electrodes with a high coplanarity in height. The semiconductor element is mounted on this substrate using a combination of a conductive resin and a sealing resin or an anisotropic conductive sheet. Every top of the bump electrodes after the conductive adhesive is applied has a high coplanarity. The semiconductor element can be mounted with high reliability, on the substrate having such a poor flatness of the electrode face that mounting by a conventional method can not be applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.