Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein
US6208019A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Mar 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A card-type semiconductor device including a thin (e.g., 30 to 70 .mu.m) semiconductor chip which is thinner than an insulating resin film embedded in a device hole of a wiring film. The wiring film includes a copper wiring layer and inner leads arranged on one main face of the insulating resin film. Electrode pads are bonded to the inner leads by heating and pressing. A sealing resin layer is formed on the exterior of the bonded portion as required, and a polyester resin film is integrally laminated on the upper and lower faces of the wiring film. The card-type semiconductor device with the above construction has sufficient strength against bending, etc., and is suitable for integrated circuit (IC) card applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.