Filter structures for integrated circuit interfaces
US6208225A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Feb 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of optimizing the frequency response of an interconnect system of the type which conveys high frequency signals between bond pads of separate integrated circuits (ICs) mounted on a printed circuit board (PCB) through inductive conductors, such as bond wires and package legs, and a trace on the surface of the PCB. To improve the interconnect system, capacitance is added to the trace and inductance is added to the conductors, with the added trace capacitance and conductor inductance being appropriately sized relative to one another and to various other interconnect system impedances to optimize the interconnect system impedance matching frequency response.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.