Wafer transport device
US6208909A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Of a plurality of wafers (15) circumferential edge portions of which are held by slot grooves (14) of a wafer cassette (13), the positions of a wafer (15) to be transferred and the wafers (15) above and beneath it are detected by a first sensor (16) and a second sensor (17). A calculating unit calculates an amount of bend of each wafer (15) based on the detected information. It is determine, based on the calculation result, whether the transfer arm (18) can be inserted under the wafer (15) to be transferred without contacting with the wafer beneath (15) and whether the wafer (15) to be transferred can be lifted up by the transfer arm (18) without contacting with the wafer above (15).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.