Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern(s)
US6210254A · kind A · utility
39Cited by
26References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2000 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Feb 2, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An innovative method of manufacturing polishing pads using photo-curing polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and enables the use of pad materials otherwise too soft to pattern by conventional machining techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.