Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6210525A · kind A · utility
10Cited by
14References
10Claims
0Family size
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Key dates
| Filing date | Aug 9, 2000 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Aug 9, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B23/0021
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.