Electrolyte and tin-silver electroplating process
US6210556A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 1999 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Feb 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electrolyte for depositing tin-rich tin-silver alloys upon a substrate. This electrolyte includes a basis solution containing a solution soluble tin and silver compounds; a tin chelating agent of a polyhydroxy compound in an amount sufficient to complex tin ions provided by the tin compound; and a silver chelating agent of a heterocyclic compound in an amount sufficient to complex silver ions provided by the silver compound. Preferably, the tin and silver compounds are present in relative amounts to enable deposits containing about 85 to 99% by weight tin and about 0.5 to 15% by weight silver to be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.