Enhanced plasma mode and computer system for plasma immersion ion implantation
US6213050A · kind A · utility
61Cited by
25References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1998 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Dec 1, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32431
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A novel plasma treatment system (200) including one or more novel computer codes. These codes provide a high density plasma for plasma immersion ion implantation applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.