Wei Liu
31Patents
5h-index
47Co-inventors
69Inventor score
Filing activity: Dec 1, 1998 → May 19, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6213050A | Enhanced plasma mode and computer system for plasma immersion ion implantation | Electricity | 61 | Expired |
| US6300227A | Enhanced plasma mode and system for plasma immersion ion implantation | Electricity | 46 | Expired |
| US9054048B2 | NH3 containing plasma nitridation of a layer on a substrate | Electricity | 7 | Active |
| US10347492B2 | Modifying work function of a metal film with a plasma process | Electricity | 5 | Active |
| US9177787B2 | NH3 containing plasma nitridation of a layer of a three dimensional structure on a substrate | Electricity | 5 | Active |
| US9831091B2 | Plasma treating a process chamber | Electricity | 4 | Active |
| US11658006B2 | Plasma sources and plasma processing apparatus thereof | Electricity | 3 | Active |
| US10103027B2 | Hydrogenation and nitridization processes for modifying effective oxide thickness of a film | Electricity | 3 | Active |
| USD976001S1 | Box for transporting boards | General | 2 | Active |
| US9048190B2 | Methods and apparatus for processing substrates using an ion shield | Electricity | 2 | Active |
| US10290504B2 | Plasma treating a process chamber | Electricity | 1 | Active |
| US11854770B2 | Plasma processing with independent temperature control | Electricity | 1 | Active |
| US11152221B2 | Methods and apparatus for metal silicide deposition | Electricity | 1 | Active |
| US10504779B2 | Hydrogenation and nitridization processes for reducing oxygen content in a film | Electricity | 0 | Active |
| US11615986B2 | Methods and apparatus for metal silicide deposition | Electricity | 0 | Active |
| US9355820B2 | Methods for removing carbon containing films | Electricity | 0 | Active |
| US12354843B2 | Process chamber process kit with protective coating | Electricity | 0 | Active |
| US9966271B2 | Method for modifying epitaxial growth shape | Electricity | 0 | Active |
| US10431466B2 | Hydrogenation and nitridization processes for modifying effective oxide thickness of a film | Electricity | 0 | Active |
| US12237190B2 | Supporting shelf module and wafer container using same | Performing Operations; Transporting | 0 | Active |
| USD1068700S1 | Box for transporting boards | General | 0 | Active |
| US11987431B2 | Top-opening substrate carrier | Performing Operations; Transporting | 0 | Active |
| US10236207B2 | Hydrogenation and nitridization processes for reducing oxygen content in a film | Electricity | 0 | Active |
| US12272521B2 | Plasma sources and plasma processing apparatus thereof | Electricity | 0 | Active |
| US10510545B2 | Hydrogenation and nitridization processes for modifying effective oxide thickness of a film | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.