Method and apparatus for the aligned joining of disk-shaped semiconductor substrates
US6214692A · kind A · utility
Inventor
Key dates
| Filing date | Dec 31, 1998 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Dec 31, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In the method for the aligned joining of wafers (8, 11), the wafers (8, 11) are adjusted to a parallel position of their sides facing towards each other, are aligned according to alignment marks provided on these sides, and are then joined in a processing station (1). Both wafers (8, 11) are mounted on substrate carriers (5, 10), of which the one can be moved in only one direction from the processing station (1) into a measuring station (2), whereas the other one can in addition be adjusted in two further coordinate directions and can slightly be rotated about a vertical axis. In the measuring station there are provided microscope units with coaxial lenses (26, 27) facing towards each other. Upon introducing the first wafer (8), the microscope units are adjusted to its alignment marks. The wafer (8) is then moved back into the processing station, and the other wafer (11) on the second substrate carrier (10) is introduced into the measuring station (2), where it is brought to coincidence with the lenses (26) of the microscope units by means of its alignment marks, in this position is moved back into the processing station (1), and applied against the first wafer (8) with the alignme…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.