Erich Thallner
46Patents
6h-index
6Co-inventors
62Inventor score
Filing activity: Dec 31, 1998 → Apr 17, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6792991B2 | Device for detaching a carrier from a semi-conductor disk | Emerging Cross-Sectional Technologies | 34 | Expired |
| US6214692A | Method and apparatus for the aligned joining of disk-shaped semiconductor substrates | Emerging Cross-Sectional Technologies | 32 | Expired |
| US7909374B2 | Handling device and handling method for wafers | Emerging Cross-Sectional Technologies | 15 | Active |
| US7910454B2 | Combination of a substrate and a wafer | Emerging Cross-Sectional Technologies | 12 | Active |
| US6416579B1 | Apparatus for treating silicon wafers | Performing Operations; Transporting | 9 | Expired |
| US8157615B2 | Device and process for applying and/or detaching a wafer to/from a carrier | Electricity | 7 | Active |
| US8443864B2 | Device for stripping a wafer from a carrier | Emerging Cross-Sectional Technologies | 6 | Active |
| US9418882B2 | Device and method for aligning substrates | Electricity | 6 | Active |
| US9666470B2 | Receptacle device, device and method for handling substrate stacks | Electricity | 4 | Active |
| US6485568B1 | Apparatus for coating substrates with materials, particularly for lacquering si-wafers | Physics | 4 | Expired |
| US8586132B2 | Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US7811898B2 | Method and device for bonding wafers | Electricity | 2 | Active |
| US8926775B2 | Method and device for bonding two wafers | Electricity | 2 | Active |
| US8157307B2 | Handling device and handling method for wafers | Emerging Cross-Sectional Technologies | 2 | Active |
| US8087708B2 | Handling device and handling method for wafers | Emerging Cross-Sectional Technologies | 2 | Active |
| US8536020B2 | Combination of a substrate and a wafer | Emerging Cross-Sectional Technologies | 2 | Active |
| US9343348B2 | Substrate-product substrate combination and device and method for producing a substrate-product substrate combination | Electricity | 1 | Active |
| US10014202B2 | Device and method for aligning substrates | Emerging Cross-Sectional Technologies | 1 | Active |
| US7246445B2 | Alignment device | Electricity | 1 | Expired |
| US8118290B2 | Method for holding wafers and device for fixing two parallel arranged wafers relative to one another | Electricity | 1 | Active |
| US7547611B2 | Process and device for bonding wafers | Emerging Cross-Sectional Technologies | 1 | Active |
| US8156981B2 | Combination of a substrate and a wafer | Emerging Cross-Sectional Technologies | 1 | Active |
| US9941149B2 | Receptacle device, device and method for handling substrate stacks | Electricity | 1 | Active |
| US9052422B2 | Method and device for producing a microlens | Physics | 1 | Active |
| US9682539B2 | Substrate composite, method and device for bonding of substrates | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.